According to a recent report from the Korean outlet The Elec, the upcoming Samsung Galaxy Z Flip7 is set to be the first foldable device from Samsung to feature the company’s own Exynos 2500 chipset. This rumor isn’t new; it’s been circulating for a while, but it gained credibility with a confirmation from a senior official at Samsung Electronics.
The Exynos 2500 is expected to be manufactured using Samsung’s advanced second-generation 3nm process, known as SF3, which promises improved efficiency and performance.
The chipset is rumored to pack a powerful 10-core CPU setup, including a prime core that can hit speeds up to 3.3 GHz, two big cores at 2.75 GHz, five big cores at 2.36 GHz, and two efficiency cores at 1.8 GHz.
In the graphics department, the Exynos 2500 is expected to come with the Xclipse 950 GPU, leveraging AMD’s RDNA architecture, which should provide a significant boost in graphical performance, enhancing the user experience for gaming and multimedia on the Z Flip7.
Production of the Exynos 2500 is slated to begin in early 2025, aligning with Samsung’s timeline for the release of their next generation of foldables. Samsung has ambitious plans for 2025, aiming to manufacture 229.4 million smartphones.
Within this figure, the Z Fold7 is projected to make up 3 million units, while the less talked about Z Flip FE is expected to contribute 900,000 units to the total. This shift to Exynos for foldable could mark a new era for Samsung’s foldable lineup.
This move towards using an in-house chip for a foldable device suggests Samsung’s confidence in its Exynos technology, especially for high-profile products like the Z Flip series.
Source (Korea)
